Not recommended.
Layers separations, stress near solder joints and require close control
of tool maintenance otherwise the results will be worst.
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jim Ma
Sent: Tuesday, June 19, 2007 6:18 AM
To: [log in to unmask]
Subject: [TN] Punch Machine implement on the M/B manufacturing
Hi All:
Does anybody use the punch machine for M/B PCB breakway separate?
How
to prevent the BGA crack issue? I want to get some lesson learn material
about this case.
Thanks & Best Regards!
From:Jim Ma
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