Hi, Daan,
Without hestiation, I would recommend an InfraRed rework station. Both
Steve G and I have bought PDR's Lightmaster and have found that it removes
pretty much anything from the tightest of spaces. No nozzles so you'll
never be stuck for one again, no clearance needed round about components
for nozzle access, and contrary to popular opinion it is not only
controllable, it is very controllable. It removes SMT, through-hole,
ceramics, plastics, metalised, large, small blah, blah, blah, just about
everything from a board without damage. It also puts back BGA's and LCC's,
but for other things like QFP's, we've taken to using a manual flood
soldering technique that works really well.
My local agent here supplies a control unit of his own design that you can
buy optionally that makes controllability absoltely certain - I'm
certainly well-impressed with it. He has also come up with a number of
other innovations that improve bulb life, and other improves other things
as well. I can put you on to him off-line, if you want.
Peter
"d. terstegge" <[log in to unmask]> 27/02/2003 12:30 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "d. terstegge"
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cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] BGA rework equipment
Hi Technet,
We're planning to replace our current BGA repair equipment by something
that's more suitable for fine-pitch BGA's and microBGA's (ballpitches
down to 0.5 mm).
We can get a brandnew Airvac DRS24 (or Zevac, as it's called in Europe)
for half the price, but then we need to decide about it very soon,
without having the time to do a good evaluation.
Time to seek some expert's advice.....
A significant part of our production work is subcontracting, and new
customer-relations often start with doing some BGA-repairs for them.
It's always urgent (no time to order a nozzle), there's never a sample
board to adjust the profile, and normally there's hardly any free area
around the BGA. We see everything from fine-pitch BGA's to CBGA's, 40*40
mm heatsinked-BGA's and BGA-sockets, on boardthicknesses up to 5 mm.
From what I heard the Airvac is certainly one of the very best
rework-machines on the market, but I'm not sure if it is the best choice
(i.e. flexible enough) for our situation.
Any recommendations ?
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
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