I think we have to be more specify what is the specific LMP is.

May be all the PCB assembly (LEDs side) can be reflowed with the LMP temp.
and just change the solder paste type??????


Best  Regards

Reuven





                      Peter Swanson
                      <Peter.Swanson@INTERTRO         To:      [log in to unmask]
                      NICS.CO.UK>                     cc:
                      Sent by: TechNet                Subject: [TN] LED Soldering Query
                      <[log in to unmask]>


                      12/09/2003 11:56
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please respond
                      to Peter Swanson





We have a customer who is looking at assembling some surface mount LEDs to
a
FR-4 board. We are told that the parts will not stand conventional reflow
temperatures (they themselves are made with a LMP solder, and the lens is
temperature sensitive). At this stage, I don't know much more detail.

The query is whether he could print conventional paste, place the devices
and then reflow each joint individually, by using a robot. But a soldering
iron applied the paste will cause spitting, solder balls, etc.

Perhaps a thermode could be applied to the joint and a temperature ramp up
applied, which will safely reflow the paste, if such a thing exists and can
be mounted to a robot.

I would be interested in general thoughts on how to process these parts.
Maybe not even solder...

TIA,
Peter
--
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Peter Swanson           [log in to unmask]
INTERTRONICS               http://www.intertronics.co.uk
Tel: +44 1865 842842                Oxfordshire, England

INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to high technology
assembly industries, with the highest levels of technical
support and customer service.

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