I think we have to be more specify what is the specific LMP is. May be all the PCB assembly (LEDs side) can be reflowed with the LMP temp. and just change the solder paste type?????? Best Regards Reuven Peter Swanson <Peter.Swanson@INTERTRO To: [log in to unmask] NICS.CO.UK> cc: Sent by: TechNet Subject: [TN] LED Soldering Query <[log in to unmask]> 12/09/2003 11:56 Please respond to "TechNet E-Mail Forum."; Please respond to Peter Swanson We have a customer who is looking at assembling some surface mount LEDs to a FR-4 board. We are told that the parts will not stand conventional reflow temperatures (they themselves are made with a LMP solder, and the lens is temperature sensitive). At this stage, I don't know much more detail. The query is whether he could print conventional paste, place the devices and then reflow each joint individually, by using a robot. But a soldering iron applied the paste will cause spitting, solder balls, etc. Perhaps a thermode could be applied to the joint and a temperature ramp up applied, which will safely reflow the paste, if such a thing exists and can be mounted to a robot. I would be interested in general thoughts on how to process these parts. Maybe not even solder... TIA, Peter -- -------------------------------------------------------- Peter Swanson [log in to unmask] INTERTRONICS http://www.intertronics.co.uk Tel: +44 1865 842842 Oxfordshire, England INTERTRONICS is dedicated to providing quality material, consumable and equipment solutions to high technology assembly industries, with the highest levels of technical support and customer service. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------