that will set you back 1000.00 dollars (assume 300 per hour including
travel).
On Apr 19, 2018, at 4:20 PM, Stadem, Richard D wrote:
> Bring your attorneys dressed in their most expensive suits and
> shiny black shoes, and just have them sit there and not say
> anything and scribble notes. That always works.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Zilber Gil
> Sent: Thursday, April 19, 2018 2:55 PM
> To: [log in to unmask]
> Subject: Re: [TN] R: [TN] R: [TN] PCB failure
>
> Thanks,
> I will dig into it next week. I will probably have an unpleasant
> discussion with the PCB fab :(
>
> Regards,
> Gil
>
>
>
>
> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>
>
> -------- הודעה מקורית --------
> מאת: Dwight Mattix <[log in to unmask]>
> תאריך: 19.4.2018 19:39 (GMT+01:00)
> אל: [log in to unmask]
> נושא: Re: [TN] R: [TN] R: [TN] PCB failure
>
> Holy Post-Sep Batman!
>
> Concur, that's not assembly heat. Well yeah it likely is but an
> afternoon in the sun on the dashboard of your car might have been
> enough heat to pull that interconnect apart.
>
> IMAO (in my arrogant opinion), that's just a poorly fab'd PTH.
>
> For starters Sherlock Holmes:
> 1. Does the supplier have sections from this lot (both inprocess
> plating and final Met lab QC and solder float eval)? Review those
> 2.Do you or the supplier have any "as-is" boards that have not as
> yet been through reflow?
> If yes, get busy sectioning those and look for precursors. Go
> crazy and do some vertical grinds down to look at the post
> interconnect in the horizontal. I'll lay you odds you'll see dark
> rings and/or gaps at the hole/foil plating interface.
>
> Be prepared to go deeper into process logs, looking at actual
> working travelers, and chem lab info. They either had a recipe they
> dropped the ball on, or they don't have a recipe that's worth the
> paper it's written on. (once again, that's IMAO)>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
> Sent: Thursday, April 19, 2018 10:20 AM
> To: [log in to unmask]
> Subject: Re: [TN] R: [TN] R: [TN] PCB failure
>
> I would like to see an image of the full via, top to bottom. But, I
> see no evidence that the failure was caused by excessive heat from
> hand soldering.. Obviously, they failure could be heat induced, but
> the board structures show no signs of heat stress. They didn't put
> up much of a fight from what is visible in the photo.
>
> On Thu, Apr 19, 2018 at 12:49 PM, Zilber Gil <[log in to unmask]>
> wrote:
>
>> We require 0-5 micron etch back.
>> Gave the explanation previously.
>> Regards,
>> Gil
>>
>>
>>
>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>
>>
>> -------- הודעה מקורית --------
>> מאת: David Hillman <[log in to unmask]>
>> תאריך: 19.4.2018 16:43 (GMT+01:00)
>> אל: [log in to unmask]
>> נושא: Re: [TN] R: [TN] R: [TN] PCB failure
>>
>> Hi Wayne - etchback isn't necessary for acceptable PTH reliability
>> for
>> some products and product use environments so that may not be a
>> contributing issue. With that being said, I like etchback as it
>> always
>> makes the inner connections better/more robust and in some product
>> use
>> environments having etchback is necessary for long term product life.
>> One question we haven't asked as a group is " was etchback
>> required in
>> the fabrication requirements?"
>>
>> Dave
>>
>> On Thu, Apr 19, 2018 at 9:11 AM, Wayne Showers <
>> [log in to unmask]
>>> wrote:
>>
>>> The real problem is that this PCB has no etchback, positive or
>>> negative (PCBs are defective). As far as resin recession, yes the
>>> processing probably caused the separation, but once again, the
>>> PCB has no etchback.
>>>
>>> I would send that cross-section image to the PCB supplier and asked
>>> them if this is typical. I suspect that they will realize it is a
>>> trap and either offer a crazy answer or admit that their is no
>>> etchback and offer
>> to
>>> re-run/replace the PCBs.
>>>
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>> immediately and delete it from your computer.
>>
> The information contained in this communication is proprietary to
> Israel Aerospace Industries Ltd. and/or third parties, may contain
> confidential or privileged information, and is intended only for
> the use of the intended addressee thereof. If you are not the
> intended addressee, please be aware that any use, disclosure,
> distribution and/or copying of this communication is strictly
> prohibited. If you receive this communication in error, please
> notify the sender immediately and delete it from your computer.
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