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Wyko. OGP.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, May 15, 2015 12:24 PM
To: [log in to unmask]
Subject: [TN] measuring bump heights
Technetters, how can one measure solder or copper bump heights on an IC or PC board? Heights and spacings I am interested in are in the range of 100-200 microns and 300-400 microns, respectively.
Thanks for any help.
Maybe someone in the foil business is on technet. At EXPO, there have been discussions of foil roughness measurement techniques. My problem is, I think, an easy one by comparison. Louis Hart
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