HA! I imagine that this patent is as enforcable as the one that "patented"
using epoxy for bottomside SMT components...

Were these companies to try and enforce such patents, the losses that they
would see from such enforcement, should be of much concern to the upper
management.

If they even attempted such enforment, I for one, would do everything in my
power to not engage in any sort of business with that company...it would be
possible to do that...they have a great stake in other markets...there's many
other companies that produce memory as one example...I don't think they would
be so short sighted...

-Steve Gregory-

> Technetters...
>
> I have been reading the suggestions about how one
> verifies that laminate layers are stacked correctly.
>
> Did you know that a company, Samsung, has actually
> "patented" the idea of using offset metal pads near
> the edges of the substrate to determine that the
> layup is correct.
>
> No way! Yes way! - patent number 6,091,026 (I saw the
> patent reviewed in Chip Scale Design Magazine...November
> December 2001, page 57)
>
> So all of you using the technique - send your money
> to Samsung! And I though that patents had to be non-obvious
> to those skilled in the industry ...
>
> ========================================================
>
> Steve DiBartolomeo              [log in to unmask]
> PC Tools                     Microelectronics Tools
>