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August 1998

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TechNet <[log in to unmask]>
Subject:
Blind Via High asprct ratio, Nickel, Semi cond CWF(Complex Wave Form)
From:
Moti Holtzman <[log in to unmask]>
Date:
Sun, 23 Aug 1998 20:13:05 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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HI Every one.
From Moti Holtzman.
I would like to exchange information on work that I am doing with different
chemistry on the application above and also  Nickel plating in deep boards for
throw in the hole and uniformity of gold  also plating coper for semi
conductors instead of Aluminum I would like to share my experience and to hear
about others.
Thanks
Moti Holtzman

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