Sahmad,

Some initial increased intermetallic growth rate is seen, if the copper
surface is very clean as might be expected with high-halide type fluxes, but
after the initial joint is made and the the intermetallic grows in the solid
state, the growth rate is dependent on the difussion rate of one metal into
the other.  This is temperature dependent.  The  initial intermetallic growth
rate increase in the molten state with the higher halide fluxes is similar to
the wetting-time determinations as tested with the wetting balance techniques.

Phil Hinton

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