 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v1lhe-0000LcC; Fri, 13 Sep 96 22:47 CDT |
| Old-Return-Path: |
|
| Date: |
Fri, 13 Sep 1996 23:55:42 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"VzS5p.0.-1E.LhYEo"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Mon Sep 16 09: |
21:05 1996 |
| X-Loop: |
|
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
Try having the FAB house repress PCBS using a controlled (slower) cool down.
This will commonly flatten even the worst warp for pre heat operations (
stenciling and pick-and-place). Reflow or wave will most likely cause the
warp to return so be careful with post operation cool down ( the warp
reappears during ramp-up of temp for adhesion process, so do not try to
unwarp assembled PWB).
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
