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FROM: James D. Herard
**************************************************************
Subject: DES: Punched via
punching is used in polyimids, and perhaps in PTFE's to create
vias prior to seeding them with Cu.
IBM punches Kapton & Upliex brand polyimids with holes down
to 6 mills regularly. In materials such as polyimids
punching is a very affective process.
Jim Herard
James Herard x77026 KBLE/014-3 Quality Engineer
***************************************************************
********* Get it While you Can *********************
***************************************************************
*** Forwarding note from SMTP3 --IINUS1 10/31/96 07:04 ***
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