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| From [log in to unmask] Sat Apr 27 15: |
31:35 1996 |
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-- [ From: michael carano * EMC.Ver #2.10P ] --
------- FORWARD, Original message follows -------
> Date: Monday, 18-Dec-95 10:21 PM
>
> From: michael carano \ PRODIGY: (GNTB07A)
> To: ipc \ Internet: ([log in to unmask])
>
> Subject: plated thru hole rim voids
>
> There are a few reasons for the problem that you have described. One
> possibility is that there is too much pressure applied if the booards
are
> being scrubbed prior to dry film lamination. The other possibility is
that
> there was no catalyst in that area and thus no electroless copper
> iniation.
> What type of electroless are you using? Or are you employing a direct
> metallization process? There are several different types of DM
processes
> on the market and it is a possibility that the problem is here.
> Also, what hole size is common for the rim void? When do you see the
rim
> void? After electroless? After electroplating? After etching?
> E-mail me back with some details of your process or call 1-800-321-
9050
> and ask for Mike Carano
> Good luck
------- FORWARD, End of original message -------
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