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May 1998

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Date:
Tue, 12 May 1998 10:43:05 -0400
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EJE Research
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"Richard W. Boerdner" <[log in to unmask]>
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howdy folks!

can anyone explain the possible causes in a manufacturing process that
would result in interfacial separation after thermal stressing of a PCB?
the temperature profile parameters are -40 C to +55 C with a 6 degree
per minute rate of rise and an hour dwell time at each extreme for a
period of 12 hours. the laminate has a glass transition temperature
rating of 170-180.

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