There as been many an occasion debris or foreign matter in a via causing problems.
I personally mask over all vias, and have never had a problem, but have a question.
Yes, debris in a via and being under a pad, in encapsulated in solder or plating etc.
is a reasonable question to ask. Could there be a problem, but my question is;
Isn't this a cleanliness issue?
Is it just a fact that regardless of the manufacturer that debris or such is a fact and not
just a manufacturer issue.
Is it that, yes it may be just a manufacturer issue, but there is no accountability
before assembly and we can't just count on the board to be clean.
Or is it the time between manufacturing and assembly that we have to worry about
debris?
I've never had an issue with debris in a via, and I don't know if I have good manufacturers
or that my traces/circuits have never been that critical.
Chris Robertson
[log in to unmask]
----- Original Message -----
From: Paul Baine
To: [log in to unmask]
Sent: Friday, October 24, 2003 9:30 AM
Subject: [TN] Cleaning of via holes under components
Hello,
One of our Design Engineers is designing a surface mount PCB
assembly and would prefer not to have the via holes solder mask
tented. However, he is concerned that, if he does not call up
solder mask tenting on his bare PCB drawing, foreign matter could
find its way into a via hole and, if a component (e.g. an IC) was
mounted over the via hole, the foreign matter might not be removed
during the cleaning process.
Has anyone had experience with this situation? I would appreciate
any help you could give me.
Thanks very much in advance.
Paul Baine
Q.A. Manager
C-Tech Ltd.
Cornwall, Ontario, Canada
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
