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by ipchq.com (Smail3.1.28.1 #2)
id m0sEdRC-0000GyC; Thu, 25 May 95 08:58 CDT |
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<miso!a1.ALLIN1.umc!marsico> |
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Thu, 25 May 95 11:55:01 -0400 |
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| From [log in to unmask] Fri Apr 26 13: |
50:36 1996 |
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| Posted: |
Thu, 25 May 95 12:11:01 -0400 |
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<"TgAV_1.0.C38.Tq8nl"@ipc> |
| Subject: |
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| From: |
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
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ALL-IN-1 IOS Server for VMS V3.0 PBL123A (US) ENGLISH 21-MAR-1992 |
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We are considering replacing our present pick and place machine (10 yrs old)
with a modern system. My management is concerned that whatever we purchase
today might be obsolete in 3-5 years. The system which I have in mind has the
capability of placing 15 mil pitch leaded components, 0402s, and BGAs, pretty
much the latest technologies.
My question is this, does anyone have a grasp on where component trends are
leading? Is component packaging going to be smaller still (than 0402s) or a
different technology altogether which will render my state-of-the-art placement
system obsolete? What does the future hold for components and placement
systems?
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