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September 1998

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Subject:
From:
"Kelly M. Schriver" <[log in to unmask]>
Date:
Wed, 30 Sep 1998 15:02:36 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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text/plain (23 lines)
Hi Scott -

The via in pad is a problem UNLESS it's a microvia which only goes a layer or
two deep in the board.  Vias which go all the way thru the board will steal
solder from the connection you're trying to make on one side, then turn that
same solder into a nice spherical bead on the opposite side.

The inspectors and touch up people, in turn, have lifetime job security.

Regards - Kelly

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