Nick,

We paste all test points. It helps to increase Tester life. We found that
pogo pins last longer if they are striking solder instead of coated copper
(we use mostly HASL PCBs). If you need more we could talk off line.
FNK

Frank N Kimmey, C.I.D.
EM Designer
C & K Systems, Inc.
916-353-5366
[log in to unmask]

> ----------
> From:         Nick Nicolaides[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Nick Nicolaides
> Sent:         Wednesday, August 25, 1999 11:58 AM
> To:   [log in to unmask]
> Subject:      [TN] Solder paste on Test Point
>
> On double reflow boards our ICT test engineers now want to solder paste
> the
> solder side test points prior to reflow. We do not see any advantage to
> this
> but about 2000 more holes in the stencil. What are your ICT people saying.
>
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