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May 2004

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Subject:
Another Solder mask question
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 May 2004 14:30:09 -0500
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Good day all,
Seems the day for solder mask questions, so I will throw one out.

Are any of you aware of any published papers that work to establish a
correlation between the results of a tape test (e.g. IPC TM 650 method
2.4.28.1) and the adhesion of solder mask features (e.g. solder mask dams)?

Doug Pauls

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