Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 19 May 2004 06:49:46 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Doug,
I am not aware of any. I am working on a project to qualify new solder masks
and via fill processes. One part of that is using the tape test on the
coupons which also have the via holes. I am trying to develop a
pre-conditioning step above and beyond what is called out in 3.7.2 of
IPC-SM-840C, before re-doing the tape test. So far I can't get any failures
in a reasonable time frame to be an accepted test. I will keep you posted.
Dewey
-----Original Message-----
From: Douglas O. Pauls [mailto:[log in to unmask]]
Sent: Monday, May 17, 2004 12:30 PM
To: [log in to unmask]
Subject: [TN] Another Solder mask question
Good day all,
Seems the day for solder mask questions, so I will throw one out.
Are any of you aware of any published papers that work to establish a
correlation between the results of a tape test (e.g. IPC TM 650 method
2.4.28.1) and the adhesion of solder mask features (e.g. solder mask dams)?
Doug Pauls
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|