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Sender:	TechNet <[log in to unmask]>
Subject:	Re: Optimum Method to Apply Solder Paste to PWB's for BGA Application s?
From:	Werner Engelmaier <[log in to unmask]>
Date:	Wed, 19 Dec 2001 15:02:45 EST
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Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>
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Hi Dave,
You write:
>As a self-described proponent of flux only mounting of BGA, please help us
>understand the impact on product reliability of reduced solder in these
connections.
I am with the  Moonman on this. SJ reliability is affected by solder joint
height, not very much by solder volume. In fact, data show that
'hour-glass'-shaped SJs have slightly greater reliabiliity than
'barrel'-shaped ones.

Werner Engelmaier

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