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Date: | Wed, 17 Sep 2008 21:57:44 -0400 |
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Hi Genny,
Why would you want to use Cu balls--they do not improve reliability, because the ball is too rigid and you wind up with 2 very thin solder joints. Now polymer balls covered in Cu and solder is another matter--they improve reliability.
Werner
-----Original Message-----
From: Genny Gibbard <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, 17 Sep 2008 7:00 pm
Subject: [TN] Copper BGA balls
Anyone have experience with components using a tinned copper ball
instead of a SAC alloy solder ball?
Have you ever X-rayed one?
We are seeing voiding that does not meet the IPC-7095B spec for incoming
inspection with a transmission x-ray. However, we don't know if this is
a concern for this type of ball, or if this spec even applies to this
type of ball. I don't think these are meant to collapse and mix with
the solder on the board, like a normal solder alloy ball might.
Once again, thanks in advance for sharing your knowledge.
Genny
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