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Fri, 1 Sep 2000 07:51:29 -0700 |
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I'm looking for some guidelines for pad layouts for TC3528 tanatalum caps
which are epoxied on the bottom side of a PCB and wave soldered. On the
particular boards in question, the pads have been laid out approximately to
what the IPC Land Calculator comes up with for a B-size cap. The top-side
parts that are pasted and reflowed are fine, but the bottom side parts have
intermittent skips that appear due to not enough pad extending beyond the
part for a fillet to form. Are there any general guidelines I can pass on
to this customer regarding pad layout for these parts to be wave soldered?
On a related (sort of) subject, the IPC Land Calculator comes up with
different pad layouts for TC3528 package vs. B-size tantalum package. I
always thought these were the same. Am I misinformed?
Thanks in advance,
Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]
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