TECHNET Archives

April 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Tue, 28 Apr 2015 13:42:02 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Message-ID:
Subject:
From:
Tan Geok Ang <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="us-ascii"
Parts/Attachments:
text/plain (25 lines)
You might want to check on IPC 7351

________________________________________
From: TechNet [[log in to unmask]] on behalf of Victor Hernandez [[log in to unmask]]
Sent: Tuesday, 28 April, 2015 8:44:37 PM
To: [log in to unmask]
Subject: [TN] IPC STD, Component body

Fellow TechNetters:

   Is there an IPC STD and/or guidelines that states the physical component to PWB copper pad ration to achieve proper end cap solder fillet?

Victor,


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2