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October 1999

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Subject:
From:
Miguel Vallejo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Oct 1999 21:40:13 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (69 lines)
A solderability test on the parts on a sample basis may suffice.

> ----------
> From:         Darrel Therriault[SMTP:[log in to unmask]]
> Sent:         Thursday, October 07, 1999 5:47 PM
> To:   [log in to unmask]
> Subject:      [TN] Shelf Life
>
> TechNet,
>
> I need to tap a little expertise from the assemblers out there....
>
> I have a PWA kit to be built that has been sitting around for about
> 12-14
> months.
> No environmental storage of any kind, just in tubes and boxes in the
> stockroom.
> What dilemma's am I likely to encounter with these components, if
> any??  I
> suspect
> the boards will need to be baked, but normal duration or more based on
> length
> of time on the shelf?? Any worry about warp and coplanarity?
> Any issues with components that have not been stored
> with any dissicant or anti moisture protection?  Any worry about lead
> oxidation
> that requires cleaning/tinning for solderability/wetting concerns?
>
> Just wondering what kind of interesting things to expect or try and
> avoid,
> if any.
>
> Any suggestions or comments greatly appreciated.
>
> Tks......DT
>
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