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April 1998

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Subject:
Copper/Aluminium Clad Teflon Plating
From:
Graham Savage <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Apr 1998 11:01:59 +0930
Content-Type:
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text/plain (34 lines) 
Copper/Aluminium clad Teflon Plating

Specifically, my query concerns plating 0.5oz to 1oz copper on Teflon
with 1/8 to 1/4 Aluminium back (6061).

What is the best method of activating the Aluminium surface prior to
plating without using a nitric desmut, as this attacks the copper
surface.
or
What can be used for removing the smut on the Aluminium surface after
etching in a potassium fluoride etch which will not attack the copper
surface.

How can I achieve maximum adhesion of electroless nickel on Aluminium,
such as double dipping in Zincate. without stripping the Zincate with
Nitric

Thanks in advance

Graham Savage
[log in to unmask]

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