Hi everybody !!

I have a question regarding the well known problem of whiskers generation on
leadframes.

With the concept of lead free deposit and the investigation of several
alternatives   (Sn-Bi, Sn-Ag, Pure Tin, etc..) to Tin-Lead, we need to study
the risk of generation of whiskers with those substitutes.
It is generally agreed that Tin alloys (even at low percentage in the other
metal) are not prone to this problem whereas pure Tin deposits are.

However, does anybody have a recognized method (electrochemical, physical,
etc...) which could help in predicting the apparition, or not, of this
problem (besides the standard aging test which sometimes can be quite
doubtful !) ?

I am looking forward to your answers and comments.

Sincerely,

Stephane Menard
Micropulse Plating Concepts
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