Hi everybody !! I have a question regarding the well known problem of whiskers generation on leadframes. With the concept of lead free deposit and the investigation of several alternatives (Sn-Bi, Sn-Ag, Pure Tin, etc..) to Tin-Lead, we need to study the risk of generation of whiskers with those substitutes. It is generally agreed that Tin alloys (even at low percentage in the other metal) are not prone to this problem whereas pure Tin deposits are. However, does anybody have a recognized method (electrochemical, physical, etc...) which could help in predicting the apparition, or not, of this problem (besides the standard aging test which sometimes can be quite doubtful !) ? I am looking forward to your answers and comments. Sincerely, Stephane Menard Micropulse Plating Concepts [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################