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Content-Type:	text/plain; charset="iso-8859-1"
Sender:	TechNet <[log in to unmask]>
Subject:	Re: Specs for Wire Bond Pads
From:	"Pelkey, Glenn" <[log in to unmask]>
Date:	Mon, 9 Jul 2001 08:48:22 -0700
MIME-Version:	1.0
X-To:	"Buscomb, Scott" <[log in to unmask]>
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, "Pelkey, Glenn" <[log in to unmask]>
Parts/Attachments:	text/plain (48 lines)

Scott,

You could reference IPC-6015 or IPC-6016.  These address the cleanliness of
the whole board, purity of the metals (by reference to other specs), and
plating thickness.  Minimum thickness broken down by class and wire bonding
process.  But, I think what the others have said still applies.

Glenn

-----Original Message-----
From: Buscomb, Scott [mailto:[log in to unmask]]
Sent: Monday, July 02, 2001 7:36 AM
To: [log in to unmask]
Subject: [TN] Specs for Wire Bond Pads


I am looking for information on specifying a gold plated surface for wire
bond pads, specifically plating, surface roughness and contamination. Does a
standard industry spec exist? Is there an authoritative text on the subject?
Thanks in advance.

Scott Buscomb

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