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April 2015

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TechNet <[log in to unmask]>
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IPC <[log in to unmask]>
Date:
Thu, 23 Apr 2015 10:13:14 -0400
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Subject:
Via Fill
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From:
Steven Kelly <[log in to unmask]>
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Hi All,
Do you think it is feasible to do non-conductive via fill on a .0025- .003 finished hole size – overall thickness is .028. Regards Steve

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