Here's my thoughts:
(a) use fresh chemicals.
(b) If you are using 30% NH4OH, cut back on the DI H2O.
(c) once mixed, this etchant has a short shelf life (several hours at best)
I use 25 ml of NH4OH (50%), 25 ml DI H2O and about 0.5 ml H2O2 (3%).
Are you etching PCB copper or solid Cu slugs?
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Subject: Re: [TN] 1:1:1 Copper Etchant, Delineation Region of copper plating interface
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That's the whole problem...... I only have the listed chemicals to work with........
Victor,
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From: TechNet [mailto:[log in to unmask]] On Behalf Of Tony Lentz
Sent: Thursday, July 13, 2017 2:37 PM
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Subject: Re: [TN] 1:1:1 Copper Etchant, Delineation Region of copper plating interface
Hello Victor,
Increasing the concentration of the hydrogen peroxide will make this solution more aggressive as a copper etchant. The ammonium hydroxide is mainly there to aid in keeping the copper dissolved as a copper ammonium ion.
Best regards,
Tony Lentz
Chemist / Field Application
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Sent: Thursday, July 13, 2017 1:17 PM
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Subject: [TN] 1:1:1 Copper Etchant, Delineation Region of copper plating interface
Fellow TechNetters:
Is there any possible way to make the above stated etchant STRONGER/AGGRESSIVE: Here are the chemicals: Perhaps by varying the volume of one of the three constituents.
1 - Ammonium Hydroxide, 28.0 - 30.0%
1 - Hydrogen Peroxide, 3%
1 - Deionized water
Victor,
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