We started looking at electroless Ni/Pd/Au as a replacement for ENIG and
pattern plate Ni/Au.  Advantages seem to be solderable, wire bondable, no
black pad, full trace coverage (including sidewalls), and no undercut.  We
still need to do our homework, but passed four of the five above.

To electroplate all three makes no sense.  But, if it's a replacement for
ENIG, I suspect it is electroless.

Glenn
-----Original Message-----
From: Scott Lefebvre [mailto:[log in to unmask]]
Sent: Tuesday, June 24, 2003 11:52 AM
To: [log in to unmask]
Subject: [TN] Electro-Plated Ni/Pd/Au vs [ENIG]


I have a new board shop promoting their Electro-Plated Ni/Pd/Au (hard or
soft gold) surface finish over our existing [ENIG] boards.  We have not had
any issues with our current assemblies using [ENIG].  I am requesting any
advice or information on Electro-Plated Ni/Pd/Au and if it would be worth
switching to it.  Any advice would be greatly appreciated, thank you in
advance.

SCOTT
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