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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 1 Jun 2000 08:18:27 -0500 |
Content-Type: | text/plain |
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Good Morning,
I have an application that requires using a 474 ball and a 250 ball
CBGA in a military environment. These will be mounted on a random
kevlar Polyimide board, soft bonded to an aluminum thermal core. Has
anyone had similar experience, and what have you learned? Also will I
need to underfill the parts? If so, what would you recommend for an
underfill material? Thanks in advance for any help.
Bill
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