Ken,
Don't know you, but, I like the way you think!
This is going to be one of our biggest concerns as a CM with a considerable customer base, some Class 2 and some Class 3.
Right now, I'm thinking the worst case is if I have some customers with Lead and some without. Given that situation, not only do we need to keep track of WIP, but, also RMA material. This means that process sheets will need to be identified as to which type of solder is used (similar to No-Clean and Water Soluble). Boards may need to be labeled so as to minimize having to check the process sheet during processing. Separate solder iron tips will need to be carefully stored to prevent cross contamination. Maybe separate benches will need to be set up.
OEM's who change over don't see the product mix the CM's see, so this will be easier for them. It will certainly be easiest for the Class 1 folks making my next Game Boy -- As long as there's an electrical circuit, who cares how long it lasts....
As far as Class 3, I'd be REALLY surprised if all of Class 3 was required to transition to lead free. What does concern me here though is how do we prevent the no-lead stuff from getting into the lead stuff on the class 3 products! Again, I think documentation, labeling, checking before soldering, and segregation of work stations, will be the the best means of preventing a mix-up. All of which cost $$$$$$.
-Carrie
-----Original Message-----
From: Bloomquist, Ken [mailto:[log in to unmask]]
Sent: Tuesday, November 19, 2002 11:57 AM
To: [log in to unmask]
Subject: [TN] Lead Free Assemblies
Hey Joe, here's another opportunity for you ;-)
In a recent article from Circuits Assembly Jeff Ferry said, "Cross-contamination is a real concern". This was in regards to solder iron tips tinned with tin/lead doing rework on a lead free solder joint or visa versa. Having said that I have the following question.
How are companies keeping track of what assemblies were soldered with tin/lead and those without lead? We all have built tin/lead boards for years but now we are being forced to switch. When assemblies come back for rework what solder is the assembler supposed to use? How do they know what the board was soldered with? What is the "real" effect if the wrong alloy is used to solder an component? I'm mostly concerned with high reliability Class 3 assemblies but I'm sure there is something here for other assemblies.
Ken Bloomquist
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