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08:23 1996 |
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Tue, 26 Nov 1996 10:56:53 -0500 |
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Something could have changed in the flex piece. Is there an adhesive bonding
the copper to the dielectric? The thermal conditions could degrade it. The
ductility of the copper can also change with heat. The differential thermal
expansion between copper and organics can introduce stress. Look to a
difference in the thermal profile between the two runs.
J S Sallo Sallo Consulting
Phone or Fax 619 346 6717
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