Hi all,

What are peoples thoughts on solder resist between fine pitch micro pads???
I have recently heard two differing theories regarding this matter, one is
that solder resist between the pads on some very fine pitch QFP's will
reduce the risk of solder shorts. The other theory was that with solder
resist between these pads you could risk getting the resist onto the pads
and reducing the soldering surface???  What is the general consensus on this
matter???  Which approach to others take on this matter?

Cheers

Mike