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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 9 May 2019 06:39:28 -0400
Content-Type:
text/plain
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text/plain (172 lines)
agree.  it could be improper de-smear as well  that  could cause poor  
wetting.  If I were OP,I'll start looking for alternative board house  
- 4 layer capability should not be that hard to find in TX.  IMHO.
jk
On May 9, 2019, at 5:51 AM, Gerry Gagnon wrote:

> Dwight,
>
> Sorry to hijack your response but I had an elderly moment with this  
> keyboard on my phone. 😬😬
>
> My first vote is for poor electroless copper coverage. Could be due  
> to air bubbles as electroless does use air. Could also be that  
> electroless did not “take” due to poor hole clean and pre- 
> electroless hole prep.
>
> No electroless, no electroplating.
>
> Another possibility could be HASL which typically uses HBR as a  
> flux or pre-flux prep before the solder application. A few extra  
> “shots” through HASL process in order to meet solder thickness  
> specs could take out thin-to-no copper.
>
> Thanks and Best regards,
>
> Gerry Gagnon
>
>> On May 8, 2019, at 8:39 PM, Dwight Mattix  
>> <[log in to unmask]> wrote:
>>
>> <<The manager says "in the pattern
>>    plating tank we have no air.  >>
>>
>> /facepalm/
>>
>> I'd have asked him "Do you even lift, errr...  plate bro?"
>>
>> Dielectric reacts with plating solution and outgasses. So it's not  
>> just a matter of wetting the hole. It's a matter of continuously  
>> egressing the gas out of the hole.
>>
>> -----Original Message-----
>> From: TechNet <[log in to unmask]> On Behalf Of Robert Kondner
>> Sent: Wednesday, May 8, 2019 5:12 PM
>> To: [log in to unmask]
>> Subject: [EXT] Re: [TN] Bad Vias - Need help determining the root  
>> cause
>>
>> Be sure to let us know what you find. Enquiring Minds want to Know.
>>
>> Thanks,
>> Bob K.
>>
>> -----Original Message-----
>> From: TechNet <[log in to unmask]> On Behalf Of Christopher Brand
>> Sent: Wednesday, May 8, 2019 7:45 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Bad Vias - Need help determining the root cause
>>
>> Hi Richard, Victor, Dennis and All,
>>
>> I greatly appreciate all the help and insight so far on this.
>>
>> The boards don't have any selective or wave soldering, just reflow  
>> and hand soldering for a few thru-hole connectors.  The boards are  
>> HASL. The sample of boards in the photos are mostly 2 sided and  
>> one that is 4 layer.  These are small production runs usually.
>>
>> In talking with the manager of the board shop, he's sending out  
>> samples of their plating tanks to be tested. I've asked him the  
>> following questions from input from you folks:
>>
>>  * Air bubbles in the plating tank? The manager says "in the pattern
>>    plating tank we have no air.  solution was eductors moving the
>>    solution and swishing of the panels during plating".
>>  * Is their plating current is sufficient? The manager says that they
>>    are "plating the top of the cu scale to be sure".  Is there a  
>> method
>>    I can tell them to check if their plating current is good?
>>  * They do have a copy of IPC-9121
>>
>> I am going to look into sending out to get some of the vias  
>> microsectioned to get a better look inside them.
>>
>> Is there anything else I need/should be asking them to check?
>>
>> Thank you kindly,
>>
>> Christopher Brand
>> Ludlum Measurements, Inc.
>> 501 Oak Street
>> Sweetwater, TX 79556 USA
>> (325) 235-5494 Phone, ext:3318
>>
>>> On 5/8/2019 9:07 AM, Stadem, Richard D wrote:
>>> Christopher,
>>> Having a little more time to look at your pictures this morning,  
>>> I noticed several pics such as 006 and 010 that show gross open  
>>> breakout between the via PAD (foil copper) and via BARREL (plated- 
>>> up copper). There is no evidence of selective or wave soldering  
>>> on many of these. The breakout is on the TOP side with no  
>>> evidence of additional solder applied, therefore my only  
>>> conclusion is that the root cause was purely the plating issues  
>>> from the fabricator.
>>> dean
>>>
>>> -----Original Message-----
>>> From: TechNet <[log in to unmask]> On Behalf Of Dennis Fritz
>>> Sent: Monday, May 6, 2019 2:38 PM
>>> To: [log in to unmask]
>>> Subject: Re: [TN] Bad Vias - Need help determining the root cause
>>>
>>> Do you have a copy of IPC 9121 - troubleshooting guide?  That has  
>>> a large number of pictures of failed via holes, causes, and  
>>> remedies.
>>>
>>>> On Mon, May 6, 2019 at 3:12 PM Christopher Brand  
>>>> <[log in to unmask]> wrote:
>>>>
>>>> Greetings,
>>>>
>>>> I'm having issues with open vias on a couple of runs of PCBAs  
>>>> and was
>>>> hoping to get some help on finding a root cause or at least  
>>>> point me
>>>> in the right direction.  I know that there is lots of knowledge and
>>>> experience on this forum and I'm hoping someone will say they've  
>>>> seen
>>>> this before, as my knowledge is rather limited on this.
>>>>
>>>> Here are a few photos of the vias in question.
>>>>
>>>>    https://ludlums.com/software/BadVias/badvia_01.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_02.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_03.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_04.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_05.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_06.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_07.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_08.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_09.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_10.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_11.jpg
>>>>    https://ludlums.com/software/BadVias/badvia_12.jpg
>>>>
>>>> On some, the via barrel has a void in the center and on others the
>>>> edge of the barrel doesn't connect with the pad, Both issues are
>>>> causing an open via as you can see in the photos.
>>>>
>>>> I know that the board shop recently changed up their plating tanks
>>>> (new chemical and power supply).  Could these bad vias be the  
>>>> result
>>>> of insufficient current in the plating process or some other  
>>>> process?
>>>>
>>>> I'd be much appreciative of any insight this forum could give.
>>>>
>>>> --
>>>> Thank you kindly,
>>>>
>>>> Christopher Brand
>>>> Ludlum Measurements, Inc.
>>>> 501 Oak Street
>>>> Sweetwater, TX 79556 USA
>>>> (325) 235-5494 Phone, ext:3318
>>>>
>>>
>>> --
>>> Denny Fritz
>>> Consultant
>>> 812 584 2687

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