Li,
I dont know if I got the right end of the stick, but I guess you
are after creating PTH on ceramic boards? If not, this a way that is
pretty common, and may indicate how somebody else is doing it.
Assuming that you can get your hands on thick film inks, its a
doddle.
Use a slightly thinner than normal ink (most TF suppliers will sell
you one) and print a dot of ink over the hole itslef (I used to use
round dots as the half sphere put the bulk of the paste where it was
needed right above the hole, Ive seen others use square dots, but I
found it left a lot of paste at the edge away from the hole itself,
something to do with surface tension and geometry)
Anyway, while the ink is still wet, use a vacumm to pull the ink
through, and hey presto, a plated through hole in ceramic. Dry and
fire the ink as normal.
However, beware when pulling through, too long and it sprays all over
the back side of the plate.
Hope this helps, if not, sorry for wasting your time, and good luck
in your search.
Regards,
Roger
Roger
Motorola AIEG
______________________________ Reply Separator _________________________________
Subject: [TN] Through holes metalization for ceramic
Author: "TechNet E-Mail Forum." <[log in to unmask]> at #email
Date: 07/06/99 10:51
Hi
Can anyone provide me some infomation regarding through hole metalization
for ceramic materials? Is that similar to the electroless Cu or direct
metalization process for PWB material such as FR4?
Thanks
Li Kang
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