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Wed, 11 Sep 1996 11:17:13 +600 CDT |
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Ross,
1. Watch your copper height from your conductors (minimal).
2. Based on past experience you cannot have 4 - 8mil lines with
10mil spacings between land patterns. The standard max. land to land
spacing is 1.4mm (55mils) and the min. is 1.2mm (47mils). You
decreased your X pad but not your Y pad dimension which is critical.
You would need a min. of 82mils in between lands. 10mils between
lands and the conductors with a 5mil soldermask dam. If you
decreased your Y land anymore, you would need to watch your 1206
packages very carefully.
The standard land pattern for a 1206 is outlined in IPC-782,
section 8.
Others may disagree.
John Gulley - PE
Compuroute Inc.
Dallas, TX
214-340-0543
> Date: Wed, 11 Sep 96 10:37 WET DST
> To: [log in to unmask]
> From: [log in to unmask] (test)
> Subject: spacing/design considerations for 1206 packages
> I would like to konw if anyone out there has done a design using 1206 style
> packages and has run four traces underneath the part. By shrinking the
> standard pad in our default CAD libraries to 52 x 64 I can get four 8 mil
> lines underneath the package. It works out to 10 mil spacing with 8 mil
> lines. Anyone out there have problems with doing something like this?
>
> Thanks in advance.
>
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