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Date: | Thu, 14 Mar 2013 12:52:00 +0000 |
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Hi Paul,
I'm not sure if that particular situation can be considered as a typical case of "lifted pad of a PTH". If it was just a PTH and not a solder pad for a BGA, I'd have never asked.
The presence of a BGA on those pads might (and strongly suspect will) make those cracks to grow/propagate.
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca
-----Original Message-----
From: "Paul Reid" <[log in to unmask]>
Date: Thu, 14 Mar 2013 08:25:17
To: TechNet E-Mail Forum<[log in to unmask]>; Vladimir Igoshev. PhD<[log in to unmask]>; <[log in to unmask]>
Subject: RE: [TN] IPC-6012
Hi Vladimir,
What you have here is a lifted pad. I think that that is rejectable to 6012.
There appears to be an adiquate wrap of copper.
Best regards,
Paul Reid
________________________________
From: TechNet on behalf of Vladimir Igoshev. PhD
Sent: Wed 13/03/2013 5:18 PM
To: [log in to unmask]
Subject: [TN] IPC-6012
I have a question for boards gurus,
We run a set of tests to assess the workmanship of a PWB. The board
had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster (like pad
cratering after assembly). However, I saw nothing about it in
IPC-6012. Did I just miss it?
I'd really appreciate any contractive comments.
--
Best regards,
Vladimir Igoshev. PhD mailto:[log in to unmask]
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
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