I used to be involved in printing ceramic hybrids and we used to 'print' the
conductive inks through the holes. The ink was printed over the holes and
then a vacuum was used to pull the ink through the holes. This was done on
both sides of the ceramic tile to ensure that there was a good connection
between both sides. This operation was always the first print to be carried
out.


===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
7/06/99 03:51
>Hi
>
>Can anyone provide me some infomation regarding through hole metalization
>for ceramic materials? Is that similar to the electroless Cu or direct
>metalization process for PWB material such as FR4?
>
>Thanks
>Li Kang
>
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Mark Austin (Process Engineer)
ACW Technology Limited
Hylton Road
Petersfield
GU32 3XX
ENGLAND

TEL - +44 (0) 1730 300000
FAX - +44 (0) 1730 266045

Email - [log in to unmask]

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