TECHNET Archives

March 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Date:
Fri, 31 Mar 2000 12:27:16 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Brad L. Matthies" <[log in to unmask]>
Subject:
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset=us-ascii
Organization:
Raven Industries, Inc.
From:
"Brad L. Matthies" <[log in to unmask]>
Parts/Attachments:
text/plain (28 lines)
TN,

We are experiencing some manufacturing problems (solder bridging) and
have linked them to via hole placement.  The particular assembly we are
manufacturing has multiple via holes that are within approximately 15
Mils of SMT lands.  Does anyone have a resource that spells out safe
distances of via holes to SMT lands that they can pass along?  We are
getting ready to approach the design group for this product and are
looking for a qualified resource of information that we can use as well
as the design group.

Thanks,
BLM

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2