A few years ago Siemens did an injection moulded BGA type package which
they called PGA. The polymer they used was PPA (polyphthalymide) which
is both reflowable and plateable.
On 03/03/2011 22:28, Stadem, Richard D. wrote:
> Steve,
> You may wish to look at a material called Cirlex. http://www.cirlex.com/
> I have used it to make BGA sockets and other components. It can withstand very high temps, is slightly plastic, but can be milled, cut, laser etched, bonded, laminated, etc.
> It is a derivative of Kapton, but tougher and stiffer.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Thursday, March 03, 2011 3:30 PM
> To: [log in to unmask]
> Subject: Re: [TN] Semiconductor Molding Compounds
>
> http://en.wikipedia.org/wiki/Polyoxymethylene
>
> also named Delrin or POM. You can get a extremly ion free from Hoechst, at
> least when we bought from them 10 years ago.
>
> Inge
>
>
>
>
> On 3 March 2011 11:33, Douglas Pauls<[log in to unmask]> wrote:
>
>> Steve,
>> You might take a look at Henkel's MacroMelt material. Made for
>> electronics.
>>
>> Doug Pauls
>>
>>
>>
>> Steven Creswick<[log in to unmask]>
>> Sent by: TechNet<[log in to unmask]>
>> 03/03/2011 01:13 PM
>> Please respond to
>> TechNet E-Mail Forum<[log in to unmask]>; Please respond to
>> Steven Creswick<[log in to unmask]>
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> [TN] Semiconductor Molding Compounds
>>
>>
>>
>>
>>
>>
>> Dear Techsters,
>>
>> I have a question that I could use some input on. I realize that it may
>> be
>> a bit off the wall for this forum but there are a lot of different folks
>> out
>> there.
>>
>> Traditional IC molding compounds are thermoset in nature. Companies like
>> Sumitomo, Nitto Denko, and Hysol-Henkel are major players.
>>
>> What about for an application where the requirements are not as extreme,
>> no
>> soldering, and mechanical device protection is more important? There are
>> glass fiber filled thermoplastics that will withstand the potential use
>> environment, but are there any which are ionically clean enough and filled
>> in such a manner [silica vs glass fiber, etc] that they can be used with
>> thermoplastic injection equipment to overmold a chip and wire combo?
>>
>> Names and numbers would be helpful
>>
>> Inquiring minds sometimes ask silly questions
>>
>>
>> Steve Creswick
>> http://www.linkedin.com/in/stevencreswick
>>
>>
>>
>>
>>
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--
Eric Christison
Consumer& Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
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