A few years ago Siemens did an injection moulded BGA type package which they called PGA. The polymer they used was PPA (polyphthalymide) which is both reflowable and plateable. On 03/03/2011 22:28, Stadem, Richard D. wrote: > Steve, > You may wish to look at a material called Cirlex. http://www.cirlex.com/ > I have used it to make BGA sockets and other components. It can withstand very high temps, is slightly plastic, but can be milled, cut, laser etched, bonded, laminated, etc. > It is a derivative of Kapton, but tougher and stiffer. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord > Sent: Thursday, March 03, 2011 3:30 PM > To: [log in to unmask] > Subject: Re: [TN] Semiconductor Molding Compounds > > http://en.wikipedia.org/wiki/Polyoxymethylene > > also named Delrin or POM. You can get a extremly ion free from Hoechst, at > least when we bought from them 10 years ago. > > Inge > > > > > On 3 March 2011 11:33, Douglas Pauls<[log in to unmask]> wrote: > >> Steve, >> You might take a look at Henkel's MacroMelt material. Made for >> electronics. >> >> Doug Pauls >> >> >> >> Steven Creswick<[log in to unmask]> >> Sent by: TechNet<[log in to unmask]> >> 03/03/2011 01:13 PM >> Please respond to >> TechNet E-Mail Forum<[log in to unmask]>; Please respond to >> Steven Creswick<[log in to unmask]> >> >> >> To >> [log in to unmask] >> cc >> >> Subject >> [TN] Semiconductor Molding Compounds >> >> >> >> >> >> >> Dear Techsters, >> >> I have a question that I could use some input on. I realize that it may >> be >> a bit off the wall for this forum but there are a lot of different folks >> out >> there. >> >> Traditional IC molding compounds are thermoset in nature. Companies like >> Sumitomo, Nitto Denko, and Hysol-Henkel are major players. >> >> What about for an application where the requirements are not as extreme, >> no >> soldering, and mechanical device protection is more important? There are >> glass fiber filled thermoplastics that will withstand the potential use >> environment, but are there any which are ionically clean enough and filled >> in such a manner [silica vs glass fiber, etc] that they can be used with >> thermoplastic injection equipment to overmold a chip and wire combo? >> >> Names and numbers would be helpful >> >> Inquiring minds sometimes ask silly questions >> >> >> Steve Creswick >> http://www.linkedin.com/in/stevencreswick >> >> >> >> >> >> ______________________________________________________________________ >> This email has been scanned by the MessageLabs Email Security System. >> For more information please contact helpdesk at x2960 or [log in to unmask] >> ______________________________________________________________________ >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> 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