Hi All,
Sn62Pb36Ag02 is an eutectic alloy! Melting temperature is 179C (see
J-STD-006).
Gusti
-----Original Message-----
From: Gary Camac [mailto:[log in to unmask]]
Sent: Wednesday, October 30, 2002 1:58 PM
To: [log in to unmask]
Subject: Re: [TN] Round Pads for 0402 Parts?
Steve and all,
I have to ask. If it is contended that the reduction is tombstoning when
using 2% silver solder is due to its plastic range, why not use a 60/40 or
solder? It too has a small plastic range.
Gary Camac
----- Original Message -----
From: Steve Gregory <mailto:[log in to unmask]>
To: [log in to unmask] <mailto:[log in to unmask]>
Sent: Tuesday, October 29, 2002 7:19 PM
Subject: Re: [TN] Round Pads for 0402 Parts?
Hi Rick!
Absolutley!!! SMT Magazine just had an article talking about "Phased Reflow
Soldering". Basically, you have a longer plastic phase with a 2% silver
solder that allows the flux to work more, and allow the wetting to equalize
before becoming completely liquidous, which reduces tombstones...
The article talks about different mesh sizes of the solder powder too, but I
found here, with boards that have had tombstoning with 0402's in the past,
when I switched to a 2% silver paste, problem was solved...completely...I'm
serious.
You will be amazed...
-Steve Gregory-
Steve,
Any feedback is appreciated. Are you saying that you've been able to
document a reduction in tombstoning on 0402's using 2% silver solder paste?
Hadn't heard of that one. Anybody else using it with these results?
Rick Thompson
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