TECHNET Archives

April 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Tue, 6 Apr 1999 17:00:56 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Aura Esporlas <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
Cold Solder/Rough Solder/Dull solder
MIME-Version:
1.0
Content-transfer-encoding:
7BIT
From:
Aura Esporlas <[log in to unmask]>
Comments:
Authenticated sender is <aesporlas@[192.10.50.218]>
Parts/Attachments:
text/plain (22 lines) 
Hi techner's

Anyone who can help me solve cold solder located at the plating of
the flex PCB.  It was occured  after reflow process.

Any idea is highly appreciated


Thanks in advance

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2