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by ipc.org (Smail3.1.28.1 #2)
id m0trBCX-0000DwC; Mon, 26 Feb 96 16:15 CST |
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Mon, 26 Feb 96 13:33:53 PST |
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| From [log in to unmask] Mon Feb 26 16: |
38:28 1996 |
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A question,
Are there any reports or IPC data which details the minimum amounts of
electroless nickel needed to provide a sufficient barrier to copper migration
and the minimum amounts immersion gold needed to provide sufficient plating
finish.
Concerns are solderability failures and corrosion of components.
Annmarie Rainford
Merix Corporation
Forest Grove, Oregon 97116
503-359-9300 x74426
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