Yes, we need pictures, not word of mouth.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Monday, March 04, 2013 7:36 AM
To: [log in to unmask]
Subject: Re: [TN] Conductive path failure in thermal cycling
Hi Dave,
Can you share an image of the defect?
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca
-----Original Message-----
From: "David D. Hillman" <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Mon, 4 Mar 2013 08:08:34
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
<[log in to unmask]>
Subject: Re: [TN] Conductive path failure in thermal cycling
Hi Ioan - I have recently ran into an plating process issue with immersion silver - the term being used to describe the anomaly is "trench etch".
This defect is made worst by lead-free soldering processes where copper dissolution comes into play. Your defect sounds like it could be "trench etch" but you have ENIG and not immersion silver. Please send Steve a couple of pictures of your defect and we'll try to sleuth out the root cause.
Dave
From: Ioan Tempea <[log in to unmask]>
To: <[log in to unmask]>
Date: 03/01/2013 03:08 PM
Subject: Re: [TN] Conductive path failure in thermal cycling
Sent by: TechNet <[log in to unmask]>
ENIG
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>
950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
[signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain
De : [log in to unmask] [mailto:[log in to unmask]]
Envoyé : March-01-13 2:30 PM
À : TechNet E-Mail Forum; Ioan Tempea
Objet : Re: [TN] Conductive path failure in thermal cycling
Hi Ioan - what is the assembly surface finish?
Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>
From: Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>>
To: <[log in to unmask]<mailto:[log in to unmask]>>
Date: 03/01/2013 10:40 AM
Subject: [TN] Conductive path failure in thermal cycling
Sent by: TechNet <[log in to unmask]<mailto:[log in to unmask]>>
________________________________
Dear Technos,
RoHS assembly, soldered with SAC305 alloy, 0.075" thick 14 layers PCB,
failing after 250 cycles (-20 C to 125 C).
Failure mode is crack between the traces and pad at 3 places. Happens on 2
TH components. Traces are 0.0055" wide, pads are 0.022" in diameter on the
via side or 0.065" on the component side. There is no tear dropping.
Should I bother figuring out if manual soldering of the TH component
fragilizes the trace-pad junction, or this is an obvious case of design
induced failure?
Thanks,
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>
950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
[signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain
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