Hello,

We have encountered major BGA voiding issue. The void is sometimes up to
70% of the joint. Under X-ray inspection we found a blind 0.006" uVia,
0.01" deep under each void. Other BGA solder joint on board w/o uVias do
not have any void problems. Board is gold over Nickel finish and 2mm
thick.

Things we tried:
Reflow profile - WS/ no-clean paste, longer soak
Washing/ baking the bare PCB
Reworked by cleaning the uVias/pads and filled with solder but still
seeing void

Has anyone seen this before? Micro-sectioning clearly showed the void
originated from the uVia. We are trying to convince the board house that
it's not our process.


Rgds,
Peter



_________________________________________________________
Do You Yahoo!?
Get your free @yahoo.com address at http://mail.yahoo.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------