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December 1997

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Subject:
Re[2]: [TN] filling vias!
From:
"Ziarek, Paul J" <[log in to unmask]>
Date:
Wed, 17 Dec 1997 10:26:08 -0600
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     Does the thermal excursion that the PWB sees at wave solder contribute
     significantly to the reliability of partially filled PTVs?  Where can
     I find data on the reliability of partially filled PTVs in multilayer
     boards?

     Paul Ziarek
     Johnson Controls
     ([log in to unmask]


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Subject: Re: [TN] filling vias!
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