Steve:

Excuse me for being dense.  If you're going to ;lug the carrier into a
socket, why do you need to remove the gold.........or did I miss something.

Don Vischulis

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen R. Gregory
Sent: Friday, November 09, 2001 6:55 PM
To: [log in to unmask]
Subject: Re: [TN] Gold removal on ceramic chip carrier...


Hi Steve!

I've used Corfin as well too, but this isn't a CLCC, it's more of a ceramic
substrated sub-assembly...it's got a whole bunch of different SMT parts on
it along with some SMT high density male headers that facilitate it being
plugged into matching SMT sockets on a larger (24" X  24", if you consider
that large) printed circuit assembly...

This whole deal is quite the challenge, to say the least...it's made for
some good dreams...er, nightmares...for me lately. Gonna keep pushing on
though, not gonna let a printed circuit assembly get the best of me...(I say
that now...hehehe)

-Steve Gregory-



  Hi Steve,
  Try this:  http://www.corfin.com <http://www.corfin.com>
  I used them a number of years ago for various component types including
  tinning of CLCCs.

  Steve Sauer